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Articles

The rise of solder paste jet printing

 

Published in Global SMT, Feb 2010. Link to article...


Creating the Intelligent Factory

 

Published in SMT Magazine, March 2009. Link to article...


Solder paste Jet Printing

 

A new approach to solder paste application. Link to article...


Tackling SMT enemy number one

 

Raising the standard of solder paste application. Link to article...


Startling results from reliability testing

 

Open product reliability testing in Stockholm, Sweden as part of a live production event generated some quite startling results. Link to article...


On-site capability measurement

 

Published in SMT Magazine, 2005. Link to article...

News center 2012-06-05

Latest press release:

19 FEBRUARY 2013 - MYDATA and Alpha to highlight new opportunities for jet printing of low-temperature solder paste at APEX

    

MYCenter 2.1 for smarter information management

     
    
 

Upcoming events      

  
 

JISSO PROTEC 2013
Dates: Jun 5 - Jun 7, 2013
Location: Tokyo Big Sight


Philippines Semiconductor & Electronics Convention & Exhibition
Dates: June 5 - 7 June, 2013
Location: Manila, Philippines 


Nepcon Thailand / Manufacturing Expo
Dates: June 20 -23 June, 2013
Location: Bangkok, Thailand


Electronics / Productronica India
Dates: Sep 4 – Sep 6, 2013
Location: New Delhi, India

 

 

  

MYDATA recently announced the release of MYCenter 2.1, a next-generation software solution that helps to improve control and efficiency in SMT production. Further strengthening what is already one of the most comprehensive software suites in the industry, the solution offers SMT manufacturers a robust platform that can be integrated into all types of production environments.

 

MYCenter 2.1 is part of MYDATA's ongoing effort to offer customers the industry’s best integrated and most user-friendly software suite. It provides all the functionality of our previous material handling software while adding a number of valuable enhancements and new features.


The software’s three main modules cover machine programming, data import and material handling, all unified into a highly intuitive and graphical user interface. 


 

IPC Midwest
Dates: 2010-09-28 – 2010-09-30
Location: Illinois, USA