Eliminate floating QFNs with jet printing
Challenging stencil design
QFN (Quad Flat No leads) is a package type that is getting more and more common. Thanks to its leadless design, it has many advantages such as lower cost and easier component handling. So far, however, they’ve also created headaches in terms of stencil design.
Get it just right
With jet printing, it is easy to achieve high-quality solder joints and avoid component floating, by optimizing paste volumes and shapes for every solder joint. With a jet printer you can:
- deposit enough paste to compensate for not having bumps
- build piles of solder paste to ensure contact
- optimize center pad – enough paste to ensure wetting but not floating