TPSys®, the company’s Linux-based system software, is designed to speed up setups and changeovers with its sophisticated recognition and database capabilities. New features in version 2.3 include AutoTeach for package definition and improved vision algorithms for advanced packages.

The AutoTeach function creates a new package definition in seconds by capturing an image of the package and analyzing it using the latest filtering and pattern-recognition technology. TPSys® detects the coordinates of the leads or solder balls, and measures all other geometrical data such as lead length, lead width and ball diameter. When a new package definition has been created, the machine will pick the component and perform a test centering.

Another important new feature is a vision algorithm that improves the centering of components like CCGA, flipchip and CSBGA with low contrast or complicated backgrounds.

TPSys® 2.3 also features test centering for easy package verification; a Web interface with graphical viewer; bar code reader on stand-alone server; support for remote network printers; and support for the T6 board handling system.