Introducing the MY500 –
the SMT industry’s first jet printer
KEY BENEFITS
Stencil free.
Improved process control.
Enables higher density of components on PCBs.
Virtually eliminates changeover and lead times.
Designed for fast changeovers and maximum uptime.
Complete off-line preparation.
The MY500 has been awarded as Innovative Technology Center winner 2008.The machine was showcased at the Innovative Technology Center (ITC) at the 2008 IPC Printed Circuits Expo®, APEX® and the Designers Summit. The ITC showcases new and emerging technologies from all segments of the electronic interconnect industry.
Using a revolutionary new technology for solder paste application, the MY500 shoots solder paste on the fly without touching the PCB.
Because it needs no stencils, it offers many advantages over the
standard screen printer – like more PCB design freedom and virtually no changeover or lead times. Solder paste deposits can be adjusted on-the-spot in three dimensions.
